发明名称 |
Method for manufacturing liquid ejection head |
摘要 |
A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part. |
申请公布号 |
US8968584(B2) |
申请公布日期 |
2015.03.03 |
申请号 |
US201313953082 |
申请日期 |
2013.07.29 |
申请人 |
Canon Kabushiki Kaisha |
发明人 |
Yamamuro Jun;Tagawa Yoshinori;Ibe Satoshi;Komiyama Hiroto;Hasegawa Kouji;Sujaku Shiro |
分类号 |
G01D15/00;B41J2/16 |
主分类号 |
G01D15/00 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A method for manufacturing a liquid ejection head including: a device chip for liquid ejection including an ejection energy generating element and a supply port; and a liquid supply part that supplies liquid to the supply port, the method comprising the steps of:
disposing an etching mask layer on a substrate having a first face, on which the ejection energy generating element is provided, and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the supply port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting the device chip for liquid ejection; and connecting the selected device chip for liquid ejection to the liquid supply part. |
地址 |
Tokyo JP |