发明名称 |
Glass substrate-holding tool and method for producing an EUV mask blank by employing the same |
摘要 |
A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2. |
申请公布号 |
US8967608(B2) |
申请公布日期 |
2015.03.03 |
申请号 |
US201213347150 |
申请日期 |
2012.01.10 |
申请人 |
Asahi Glass Company, Limited |
发明人 |
Mitsumori Takahiro;Kinoshita Takeru;Ise Hirotoshi |
分类号 |
H01L21/687;C23C14/50;G03F1/24;H01L21/677;H01L21/683 |
主分类号 |
H01L21/687 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A glass substrate-holding tool which is adapted to be employed during the production of a reflective mask blank for EUV lithography (EUVL), comprising:
an electrostatic chuck configured to catch and hold a portion of a rear surface of a glass substrate; and a mechanical chuck including pressing portions and configured to press portions of a film deposition surface of the glass substrate by the pressing portions so as to clamp and hold the glass substrate from a side of the film deposition surface and a side of the rear surface; wherein a caught and held portion of the glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of the film deposition surface and the rear surface of the glass substrate; wherein the sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf; and wherein a pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2. |
地址 |
Tokyo JP |