发明名称 Glass substrate-holding tool and method for producing an EUV mask blank by employing the same
摘要 A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.
申请公布号 US8967608(B2) 申请公布日期 2015.03.03
申请号 US201213347150 申请日期 2012.01.10
申请人 Asahi Glass Company, Limited 发明人 Mitsumori Takahiro;Kinoshita Takeru;Ise Hirotoshi
分类号 H01L21/687;C23C14/50;G03F1/24;H01L21/677;H01L21/683 主分类号 H01L21/687
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A glass substrate-holding tool which is adapted to be employed during the production of a reflective mask blank for EUV lithography (EUVL), comprising: an electrostatic chuck configured to catch and hold a portion of a rear surface of a glass substrate; and a mechanical chuck including pressing portions and configured to press portions of a film deposition surface of the glass substrate by the pressing portions so as to clamp and hold the glass substrate from a side of the film deposition surface and a side of the rear surface; wherein a caught and held portion of the glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of the film deposition surface and the rear surface of the glass substrate; wherein the sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf; and wherein a pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.
地址 Tokyo JP