Three axis magnetic sensor device and method using flex cables

摘要

A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.

主权项

1. A method for fabricating a device for sensing magnetic fields, the method comprising:
providing a substrate member having a first surface region and a second surface region; forming an integrated circuit (IC) layer overlying a portion of the first surface region and a portion of the second surface region of the substrate member, the IC layer having one or more first bond pads formed overlying the first surface region and one or more second bond pads formed overlying the second surface region; forming a first magnetic field sensor element operably coupled to the IC layer, the first magnetic field sensor element being disposed overlying the first surface region and being configured to detect at least a first direction; forming a second magnetic field sensor element operably coupled to the IC layer, the second magnetic field sensor element being disposed overlying the first surface region and being configured to detect at least a second direction; forming a third magnetic field sensor element operably coupled to the IC layer, the third magnetic field sensor element being disposed overlying the second surface region and being configured to detect at least a third direction; forming one or more conductive cables coupling at least one of the first bond pad(s) and at least one of the second bond pad(s) of the IC layer; removing a first portion of the substrate member and a first portion of the IC layer within a vicinity of the one or more conductive cables, thereby separating a second portion of the substrate member from a third portion of the substrate member, and separating a second portion of the IC layer from a third portion of the IC layer,
wherein the second portion of the substrate member comprises a first surface region and a second surface region, the first surface region of the second portion of the substrate member including at least a part of the first surface region of the substrate member,wherein the third portion of the substrate member comprises a first surface region and a second surface region, the first surface region of the third portion of the substrate member including at least a part of the second surface region of the substrate member,wherein the second portion of the IC layer is disposed overlying the first surface region of the second portion of the substrate member, the second portion of the IC layer including the one or more first bond pads,wherein the third portion of the IC layer is disposed overlying the first surface region of the third portion of the substrate member, the third portion of the IC layer including the one or more second bond pads,wherein the one or more conductive cables electrically couple the second and the third portions of the IC layer via the first and second bond pad(s); and coupling the third portion of the substrate member to the second portion of the substrate member, the second surface region of the third portion of the substrate member coupled to the second surface region of the second portion of the substrate member.