Thermally enhanced heat spreader for flip chip packaging

摘要

A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber.

主权项

1. A microelectronic package, comprising:
a die having a first surface and a second surface, the first surface coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader configured to dissipate heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material, the heat spreader comprising:
a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the inner chamber,a wick layer positioned in the inner chamber, andan attachment frame securing the lid to the substrate; wherein the attachment frame extends continuously for 360 degrees in a circumferential direction of the lid, and wherein the attachment frame has a first member and a second member transverse to the first member, the first member engaging the lid from above, a bottom surface of the second member secured to the top surface of the substrate, the attachment frame extending continuously from the first member to the second member.