Laser ablation tape for solder interconnect formation

摘要

A tape capable of laser ablation may be used in the formation of microelectronic interconnects, wherein the tape may be attached to bond pads on a microelectronic device and vias may be formed by laser ablation through the tape to expose at least a portion of corresponding bond pads. The microelectronic interconnects may be formed on the bond pads within the vias, such as by solder paste printing and solder reflow. The laser ablation tape can be removed after the formation of the microelectronic interconnects.

主权项

1. A method of forming microelectronic devices, the method comprising:
providing a microelectronic device having at least one bond pad projecting above an active surface of the microelectronic device; attaching a laser ablation tape to the at least one bond pad; laser ablating at least one via through the laser ablation tape to expose at least a portion of the at least one bond pad; forming a microelectronic interconnect on the at least one bond pad within the at least one via; and removing the laser ablation tape.