Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method

摘要

A carrier apparatus positions a chuck member above a wafer mounted on a fine movement stage, relatively moves the chuck member and the fine movement stage in a vertical direction, makes the chuck member approach a position which is a predetermined distance away from the upper surface of the wafer, makes the chuck member hold the wafer from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer held in a non-contact manner from above by the chuck member on the fine movement stage.

主权项

1. An object exchange method in which a thin plate-shaped object is exchanged on a holding member, the method comprising:
positioning an unload member above the object which is mounted on the holding member, the unload member having a holding surface configured to hold the object from above in a non-contact manner; relatively moving the unload member and the holding member in a vertical direction, and making the holding surface of the unload member approach a position which is a predetermined distance away from an upper surface of the object, the object being lifted toward the unload member by a lift member at the movement in the vertical direction; and making the unload member hold the object from above in a non-contact manner, and making the unload member holding the object and the holding member move apart.