System and method for functional verification of multi-die 3D ICs

摘要

A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.

主权项

1. A method for verifying a functionality of ones of a plurality of dies arranged in a stack of dies, the method comprising the steps of:
(a) operatively connecting a first die of said plural dies to a test bench external to the stack of dies and to a first peripheral module external to the stack of dies; (b) verifying a functionality of said first die to thereby produce a first input/output (“IO”) trace in a first format, wherein said first format is a signal level format; (c) disconnecting said first die from said test bench; (d) translating said first IO trace in the first format to a first IO trace in a second format, wherein said second format is a transaction level format; (e) operatively connecting a second die of said plural dies to said test bench and to a second peripheral module; (f) applying said first IO trace in the second format to said test bench; and (g) verifying a functionality of said second die via said first IO trace in the second format by using said test bench.