WATER-REPELLENT PROTECTIVE FILM FORMATION AGENT, CHEMICAL SOLUTION FOR FORMING WATER-REPELLENT PROTECTIVE FILM, AND WAFER CLEANING METHOD USING CHEMICAL SOLUTION

摘要

A water repellent protective film forming agent is provided for forming a protective film on a wafer that has an uneven pattern at its surface. The protective film is formed at least on surfaces of recessed portions of the wafer at the time of cleaning the wafer. The wafer is a wafer that contains a material including silicon element at least at the surfaces of the recessed portions of the uneven pattern or a wafer that contains at least one kind of material selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride and ruthenium at least at a part of the surfaces of the recessed portions of the uneven pattern. The water repellent protective film forming agent is provided to contain a silicon compound represented by the following general formula [1]: R1aSiX4-a[1]