Low stress substrate and formation method

摘要

A bumped substrate is optimized to be flat post reflow. By producing the bumped substrate to be flat post reflow, device reliability is assured. More particularly, the transistor shift associated with warped substrates is avoided. Further, by producing a flat bumped substrate post reflow, reliability in the flip chip interconnections is assured as compared to the undesirable open circuits associated with warped substrates.

主权项

1. A method comprising:
reflowing a bumped substrate comprising a bump layer; measuring a delta bow of the bumped substrate after the reflowing; determining whether the measured delta bow is acceptable, and; if it is determined that the measured delta bow is not acceptable, adjusting one or more formation parameters of one or more sublayers of the bump layer while keeping thicknesses of the one or more sublayers the same.