Copper interconnect structure and its formation

摘要

A structure with improved electromigration resistance and methods for making the same. A structure having improved electromigration resistance includes a bulk interconnect having a dual layer cap and a dielectric capping layer. The dual layer cap includes a bottom metallic portion and a top metal oxide portion. Preferably the metal oxide portion is MnO or MnSiO and the metallic portion is Mn or CuMn. The structure is created by doping the interconnect with an impurity (Mn in the preferred embodiment), and then creating lattice defects at a top portion of the interconnect. The defects drive increased impurity migration to the top surface of the interconnect. When the dielectric capping layer is formed, a portion reacts with the segregated impurities, thus forming the dual layer cap on the interconnect. Lattice defects at the Cu surface can be created by plasma treatment, ion implantation, a compressive film, or other means.

主权项

1. The method of forming an interconnect structure with improved electromigration resistance, the method comprising:
forming an opening in a dielectric region on a substrate; forming an impurity containing layer; substantially filling the opening with a bulk conductor; stressing a top region of the bulk conductor or creating defects at a top region of the bulk conductor; and thermally treating the substrate thereby forming an impurity containing oxide layer and a metallic impurity layer at the top region of the bulk conductor.