| 摘要 |
<p>To inspect a solder joint, firstly, the position of one end point on the upper surface of a component is obtained when the component is observed laterally. Secondly, the inside of a polygon formed to have at least the part of the solder joint is set as an inspection area based on the position of the end point as a reference position, wherein the position of the end point is obtained when the component is observed laterally. Finally, whether the solder joint is defective or not is determined based on the height of the solder joint in the inspection area. Therefore, the solder joint can be inspected accurately and effectively.</p> |
