| 摘要 |
<p>Provided is a magnetic sensor package comprising a package body having a space therein, a magnetic sensor unit disposed in the package body and sensing a magnetic field by a measurement target current, and a conducting wire unit disposed in the space of the package body and applying the measurement target current. Thus, a distance between the conducting wire as a current source and a micro electro mechanical systems (MEMS) magnetic field sensor can be uniformly aligned constantly in a wafer level stage. Thus, since the distance between the conducting wire and the sensor is not varied according to situations, sensing can be accurately performed, and since the conductive wire is inserted into the package or a chip, a distance between the sensor and the conducting wire can be minimized.</p> |
