Imaging device

摘要

An imaging device includes: an imaging sensor 110 configured to capture an optical image of an object and generate image data; a main circuit substrate 120 configured to perform signal processing of the image data generated by the imaging sensor 110; a mounting component 130 configured to mount the imaging sensor 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; and an electrically-conductive section 190 configured to electrically connect between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive section 190 is positioned in an area where the metal plate 150 and the imaging sensor 110 overlap each other in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.

主权项

1. An imaging device for taking an image of an object, the imaging device comprising:
an imaging sensor configured to capture an optical image of an object, and generate image data; a main circuit substrate, including a ground conductor exposed on a surface of the main circuit substrate, disposed behind the imaging sensor, and configured to perform signal processing of the image data generated by the imaging sensor; a mounting component configured to mount the imaging sensor; a metal plate disposed between the mounting component and the main circuit substrate; and an electrically-conductive section being an electrically-conductive member joined to the ground conductor of the main circuit substrate and being in contact with the metal plate, the electrically-conductive section configured to electrically connect between the ground conductor and the metal plate, wherein the electrically-conductive section is positioned in an area where the metal plate and the imaging sensor overlap each other in the case of a back surface of the metal plate being viewed in a direction orthogonal thereto.