| 发明名称 |
Semiconductor device and method of assembling same |
| 摘要 |
A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process. |
| 申请公布号 |
US8969135(B2) |
申请公布日期 |
2015.03.03 |
| 申请号 |
US201314077174 |
申请日期 |
2013.11.11 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Liu Peng;He Qingchun;Qi Zhaobin;Xu Liqiang;Zhao Tong |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L23/495;H01L25/00 |
主分类号 |
H01L21/44 |
| 代理机构 |
|
代理人 |
Bergere Charles |
| 主权项 |
1. A semiconductor device, comprising:
a lead frame having a down bond area and a die attach area; and a dam formed between the down bond area and the die attach area, wherein a bottom of the dam is attached on a surface of the lead frame, and wherein the dam prevents contamination of the down bond area from die attach material, wherein the dam comprises a wire having a series of abutting stitch bonds. |
| 地址 |
Austin TX US |
