Atomic layer deposition apparatus

摘要

An atomic deposition apparatus is provided for simultaneously loading/unloading a plurality of substrates. The atomic deposition apparatus which may load/unload the plurality of substrates when transmitting the plurality of substrates to a process module, includes a loading/unloading module for loading/unloading a substrate, a process module including a plurality of process chambers for simultaneously receiving a plurality of substrates and performing a deposition process, each of the plurality of process chambers including a gas spraying unit having an exhaust portion by which an exhaust gas is drawn in from inside the process chamber and the drawn in gas is exhausted above the process chamber, and a transfer module including a transfer robot provided between the loading/unloading module and the process module, the transfer robot being adopted for simultaneously holding the plurality of substrates while transporting the substrate.

主权项

1. An atomic layer deposition apparatus, comprising:
a loading/unloading module for loading/unloading a substrate; a process module including a plurality of process chambers for simultaneously receiving a plurality of substrates and performing a deposition process, each of the plurality of process chambers including a gas spraying unit having an exhaust portion by which an exhaust gas is drawn in from inside the process chamber and the drawn in gas is exhausted above the process chamber; and a transfer module including a transfer robot provided between the loading/unloading module and the process module, the transfer robot being adapted for simultaneously loading at least two of the plurality of substrates into a common one of the plurality of process chambers, the common one of the plurality of process chambers including: a susceptor unit having a common susceptor surface with a plurality of loaded positions and seated positions, each of the positions adapted to support a substrate, the susceptor surface being rotatably provided to allow the plurality of substrates to be laterally seated/supported on the common surface and revolved; a plurality of lift pins provided on the susceptor unit to allow the substrate to be seated on the lift pins, a first set of lift pins corresponding to one of the loaded positions having a first length and a second set of the lift pins corresponding to a second one of the loaded positions having a second length different from the first length whereby the lift pins are configured to protrude at different heights from the common susceptor surface to accept the at least two of the plurality of substrates from the transfer robot; a heater unit provided on a lower portion of the susceptor unit and adopted for heating the substrate and the susceptor unit, the heater unit including pin guide holes formed adjacent the seated positions for the substrates and no pin guide holes adjacent the loaded positions for the substrates; the loading/unloading module includes a load port in which the plurality of substrates are stored and a buffer; and the buffer disposed at a side of the transfer module to which the load port is not connected is provided to store a plurality of substrates, and is disposed at a side of the transfer module for the transfer robot to transport the substrates in the buffer providing the same number of the substrates as a number of substrates that are lacking when loading the substrate for a number of substrates stored in the load port and a number of substrates received in the process chamber to be multiples of one another.