Disposición con al menos un objeto a envasar y con un envase de transporte y procedimiento para su fabricación

摘要

#CMT# #/CMT# The arrangement (1) has a covering layer (10) formed with a main surface (100) facing towards an object (5) i.e. power semiconductor module, to be packed. An intermediate layer (20) is arranged on a plastic layer (130) that is arranged in the main surface, and the covering layer comprises openings on the plastic layer. A covering film not fully covers a part of the object that lies on the plastic layer and lies in a housing (50). The film is adhesively connected with a main surface (200) of the intermediate layer and with the plastic layer in a region of an auxiliary surface (140). #CMT# : #/CMT# The covering layer and/or intermediate layer consist of paperboard and cardboard. An independent claim is also included for a method for forming an arrangement for transporting an object. #CMT#USE : #/CMT# Arrangement for transporting an object i.e. electro-technical product e.g. power semiconductor module (claimed), to be packed. #CMT#ADVANTAGE : #/CMT# The arrangement is designed such that the conditions for removal of the packed products even in environments with higher cleanliness requirement are fulfilled without loss and damage of the object to be packed, while protecting the object to be packaged from contamination. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a partial sectional view of an arrangement for transporting an object. 1 : Arrangement for transporting object 5 : Object 10 : Covering layer 20 : Intermediate layer 50 : Housing 100 : Main surface 130 : Plastic layer 140 : Auxiliary surface 200 : Main surface.