发明名称 SURFACE-TREATED COPPER FOIL, AND LAMINATE, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME, AND METHOD OF MAUNFACTURING PRINTED WIRING BOARD
摘要 Provided are a surface-treated copper foil favorably adhered to resin, having excellent transparency of resin after removing the copper foil by etching, and having small signal transmission loss; and a laminate using the same. The present invention relates to a surface-treated copper foil having roughening particles formed on one and/or both surfaces of the copper foil by roughening, wherein fifty or more roughening particles with equal to or less than 100 nm of long diameter are formed per each unit area with respect to the roughening particles on the roughened surface, 60° glossiness of MD of the roughened surface is 76-350 %, the roughened surface contains one or more elements selected from a group including Ni, and Co, the coating weight of Ni is equal to or less than 1,400 μg/dm^2 when the roughened surface includes Ni, and the coating weight of Co is equal to or less than 2,400 μg/dm^2 when the roughened surface includes Co.
申请公布号 KR20150021474(A) 申请公布日期 2015.03.02
申请号 KR20140107820 申请日期 2014.08.19
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 FUKUCHI RYO;NAGAURA TOMOTA;ARAI HIDETA;MIKI ATSUSHI;ARAI KOHSUKE;NAKAMURO KAICHIRO
分类号 C25D3/12;C25D5/34;C25D5/56;H05K3/22 主分类号 C25D3/12
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