| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having high insulation reliability even when a space between adjacent conductor circuits is 10 μm or less.SOLUTION: A distance between a first conductor circuit 54 and a second conductor circuit 52 on a first resin insulating layer 2 is 10 μm or less. A first side face of the first conductor circuit 54 and a first side face of the second conductor circuit 52 have an upper side wall close to the upper face and a lower side wall close to the bottom face. A roughened layer is formed on the upper side wall. The roughened layer is not formed on the lower side wall. |
