| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer adsorption device capable of adsorbing and fixing a flexible wafer so as not to generate floating.SOLUTION: A wafer adsorption device 2 comprises a stage part 11 on which a wafer W is mounted, and adsorbs and holds the wafer W. The stage part 11 is formed by joining a plurality of adsorption blocks 15 each formed from a porous material. A joint part 16 that is a portion where two adsorption blocks 15a and 15b are joined, includes: a bonding part 19 formed from an adhesive for bonding composition planes 17a and 17b; and pore filling parts 18a and 18b which are positioned adjacently with the bonding part 19 and closer to a center between both the adsorption blocks 15 relatively to the bonding part 19, and formed from a pore filling agent for filling pores of the composition planes 17a and 17b.</p> |
