| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem with a semiconductor pressure sensor, manufactured by bonding a silicon pressure sensor to a silicon pedestal or a glass pedestal and bonding the pedestal to a metal package, that if a bonded surface of the pedestal is a square or rectangular surface, a thermal stress resulting from a thermal strain of the metal package due to temperature increase concentrates on corners of the pedestal, thereby cracks occurs highly likely to the corners of the pedestal and the silicon pressure sensor is possibly damaged at the worst as well as the pedestal.SOLUTION: The pedestal or the metal package is machined so that a shape which the metal package is bonded to the pedestal, is similar to a shape of an outer circumference of a concentric circle with a through-hole. This can make a thermal stress of the pedestal, resulting from heat expansion of the metal package, uniform in a periphery of a composition surface. It is eventually possible to avoid thermal stress concentration.</p> |
