| 摘要 |
<p>According to the present invention, according to an embodiment of the present invention, a method of manufacturing a PCB product includes a circuit forming step of forming a circuit using Cu in the upper part of an insulating part, a copper plate diffusion prevention layer forming step of forming a copper plate diffusion prevention layer in the lateral and the upper part of the circuit under a region of mounting a chip on the upper part of the circuit, a solder resist forming step of forming a solder resist in the upper part of the circuit and the insulating layer to open the upper part of the circuit under a region of mounting the chip on the upper part of the circuit, and a chip mounting step of mounting the chip in the upper part of the solder resist.</p> |
