| 摘要 |
PROBLEM TO BE SOLVED: To provide a desmearing method capable of removing smear due to both an inorganic material and an organic material, and to provide a desmearing device performing the desmearing.SOLUTION: A method for desmearing a wiring board material laminating an insulation layer of resin containing a filler and a conductive layer includes a wet ultraviolet ray irradiation step for irradiating the processed part of the wiring board material, in wet state, with an ultraviolet ray under a gas atmosphere where ozone and oxygen exist, and a physical vibration step for giving physical vibration to the wiring board material via the wet ultraviolet ray irradiation step. |
