| 摘要 |
The present invention provides a method for manufacturing a terminal block attached electronic component and a terminal block attached electronic component. The present invention provides a method for reducing damage to the electronic component and improving productivity and the reliability of bonding when the terminal block is soldered on a terminal electrode of an electronic chip component. The present invention is a manufacturing method of terminal block attached electronic component where metal plate terminal blocks (16, 17) are soldered onto terminal electrodes (14, 15) formed on both sides facing the electronic chip component (2). The present invention coats cream solder (18a) on the outside of the terminal electrodes (14, 15) and inserts the electronic components (2) between terminal blocks (16, 17). The present invention obtains: the electronic component (2) where the terminal block is temporarily fixed by thermocompressing the terminal block on the terminal electrode by compressing the terminal block by a pair of heating elements (152) to face the terminal electrode; and a terminal block attached electronic component (1) by heating the temporarily fixed electronic component (2) inside a heating furnace (153) in order to melt cream solder (18a) for permanent fixation. |
