ALIGNMENT DEVICE AND INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem in which an object to be inspected by an inspection device is divided into a wafer (sometimes referred to as a mirror plane wafer or bare wafer) having no pattern and a wafer (sometimes referred to as a wafer with a pattern) having a pattern, and the positioning accuracy of the inspection device is required to be higher in order to find the position of a defect more accurately, but the positioning of the bare wafer is difficult because a mark serving as a landmark for positioning does not exist on the bare wafer.SOLUTION: The present invention includes: an optical system for acquiring an image in a first region of an outer edge part of a sample and an image in a second region located at a position different from the first region; and a processing unit for obtaining the positions of a plurality of first parts from the image in the first region and obtaining the positions of a plurality of second parts from the image in the second region.