发明名称 CURABLE COMPOSITION, TILE JOINING MATERIAL AND JOINT TILE
摘要 PROBLEM TO BE SOLVED: To provide a curable composition such that a cured product has (1) tensile characteristics so as to tightly join tiles together, (2) sufficient adhesive strength after curing and (3) flexibility such that the joined tiles are not broken even if bent.SOLUTION: There is provided a curable composition which comprises a blocked urethane, an epoxy compound and an inorganic filler, wherein the content of the inorganic filler is 20 pts.mass or more based on 100 pts.mass of the blocked urethane. The inorganic filler preferably is a metal hydroxide. In addition, the curable composition preferably further contains an acrylic plasticizer and the epoxy compound preferably is a trifunctional epoxy compound.
申请公布号 JP2015040298(A) 申请公布日期 2015.03.02
申请号 JP20130173878 申请日期 2013.08.23
申请人 CEMEDINE CO LTD 发明人 UNO TAKAHIRO
分类号 C08L75/04;C08G18/10;C08G18/58;C08K3/00;C08L63/00 主分类号 C08L75/04
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