| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows low cost and high efficiency.SOLUTION: A semiconductor device comprises: a stem 10 having a cavity 15; leads 26 and 28 provided in the stem 10; a semiconductor chip 12 mounted in the cavity 15; a matching circuit arranged in the cavity 15 and connected between the lead 26 and the semiconductor chip 12 or the lead 28 and the semiconductor chip 12; a lid 18 encapsulating the cavity 15; and an external matching circuit provided on the lid 18, connected to the lead 26 or 28 and to the matching circuit, and having a conversion amount of the impedance being larger than that in the matching circuit.</p> |
