| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve a higher definition semiconductor device.SOLUTION: A semiconductor device comprises a substrate including a semiconductor integrated circuit including first through third bump arrays which respectively include the first through third number of first through third bumps arranged in respective rows, and first through third interconnections which respectively extend from the first through third bumps. The first number is smaller than the second number and smaller than the third number. The first through third bumps are sequentially arranged from the outside to the inside of the semiconductor integrated circuit. The second and third interconnections which extend from the second and third bumps arranged among the first bumps toward the outside of the semiconductor integrated circuit through between neighboring first bumps. The respective numbers of interconnections including the second and third interconnections which extend between the first bumps are the same number and the odd number. The respective neighboring interconnections at the center of the first bumps, among the interconnections including the second and third interconnections which extend between the first bumps are connected to the bumps respectively included in the bump arrays different from each other.</p> |
