| 摘要 |
<p>The present invention relates to a method and a device for transfer-supplying a substrate. The method includes the steps of: transferring a substrate of which surface has multiple electronic parts mounted thereon to a location under the upper surface of a compressed resin sealing device; supplying compressed air to a receiving recess unit of a substrate transfer plate when the surface of the substrate on which the electronic parts are mounted is directed downward and the opposite surface of the substrate is absorbed to be maintained on the upper surface of the compressed resin sealing device; pushing up the center of the substrate which is drooped by the weight thereof to be curved and deformed; and correcting a curved deformed posture of the substrate to an approximately horizontal posture location during a posture correcting process of the substrate, thereby efficiently and surely absorbing and maintaining the substrate on the upper surface of the compressed resin sealing device.</p> |
