微机电系统元件制造方法及以此方法制造之微机电系统元件;MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY

摘要

本发明提供一种微机电系统元件之制造方法，包含：提供一积体电路元件，其中包含一基板以及位在基板上的电性结构，电性结构中包含至少一感应区与至少一第一连接部；提供一结构层，并在该结构层上形成至少一第二连接部；接合该第一连接部与该第二连接部；蚀刻该结构层以形成至少一动作结构体，该动作结构体与该感应区之位置对应，且该动作结构体经由至少一该第二连接部与至少一该第一连接部连接；以及在以上步骤之后提供一封盖，以该封盖包覆该动作结构体和该感应区，其中，该动作结构体非直接连接于该封盖。; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section with the at least one second connection section; etching the structure layer to form at least movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to one of the at least one first connection section via one of the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.