发明名称 包括测试焊垫的半导体积体电路;SEMICONDUCTOR INTEGTRATED CIRCUIT INCLUDING TEST PADS
摘要 本发明提供一种半导体积体电路包括测试输入/输出埠包括:测试焊垫;内部输入介面构成透过该测试输入/输出埠,响应外部信号以产生内部时脉、内部位址、内部命令、内部资料、与暂时储存资料;及误差检测组块构成判定该内部资料及该暂时储存资料是否相同,并透过该埠之一个测试焊垫输出结果。该内部输入介面包括资料输入/输出组块产生该内部资料,且该资料输入/输出组块包括暂时储存部分将该内部资料储存为该暂时储存资料;资料输出部分接收该暂时储存资料;及资料输入部分接收该资料输出部分之输出,并将其输出为该内部资料。; an internal input interface configured to generate an internal clock, an internal address, an internal command, internal data and temporary storage data in response to external signals through the test input/output port; and an error detection block configured to determine whether the internal data and the temporary storage data are the same, and output a result through one test pad of the port. The internal input interface includes a data input/output block which generates the internal data and the data input/output block includes a temporary storage part which stores the internal data as the temporary storage data, a data output part which receives the temporary storage data, and a data input part which receives an output of the data output part and outputs it as the internal data.
申请公布号 TW201508762 申请公布日期 2015.03.01
申请号 TW103120934 申请日期 2014.06.17
申请人 爱思开海力士有限公司 SK HYNIX INC. 发明人 李东郁 LEE, DONG UK
分类号 G11C7/10(2006.01);G11C16/06(2006.01) 主分类号 G11C7/10(2006.01)
代理机构 代理人 赖安国王立成
主权项
地址 南韩 KR