功率模组用基板之制造方法;METHOD OF PRODUCING SUBSTRATE FOR POWER MODULE

摘要

该功率模组用基板之制造方法系具备有：第一积层工程，其系在陶瓷基板(11)的其中一面侧，透过活性金属材(26)及熔点为660℃以下的熔填材(25)，将陶瓷基板(11)及铜板(22)进行积层；第二积层工程，其系在陶瓷基板(11)的另一面侧，透过接合材(27)，将陶瓷基板(11)及铝板(23)进行积层；及加热处理工程，其系将所被积层的陶瓷基板(11)、铜板(22)、及铝板(23)进行加热处理，将陶瓷基板(11)与铜板(22)、及陶瓷基板(11)与铝板(23)同时接合。 The method of producing a substrate for a power module, includes: a first layering step in which a copper plate (22) is fixed onto one side surface of a ceramics substrate (11) via an active metal (26) and a welding material (25) of which melting point is 660℃; a second layering step in which an aluminum plate (23) is fixed onto the other side surface of the ceramics substrate (11) via a joining material (27); and a heat-treating step in which the ceramics substrate (11), the copper plate (22) and the aluminum plate (23) are heated all at once; wherein the aluminum plate (23) is fixed onto the ceramics substrate (11) at the same time the copper plate (22) is fixed onto the ceramics substrate (11).