具有导电薄膜的半导体结构;SEMICONDUCTOR STRUCTURE INCLUDING CONDUCTIVE FILM

摘要

本发明的一实施例提供一种半导体结构，该半导体结构包括：焊垫向外部外露的一半导体基板；覆盖该半导体基板且为使该焊垫向外部外露而形成开口部的一保护层；形成有外引线的一印刷电路基板；及介于该半导体基板与印刷电路基板之间用于电气连接该焊垫与外引线的一导电薄膜。; a protective layer covered the semiconductor substrate and having openings for exposing the pads; a printed circuit board formed with external circuits; and a conductive film between the semiconductor substrate and the printed circuit board for electrically connecting the pads with the external circuits.