半导体密封用树脂组成物及具有其硬化物的半导体装置与半导体装置的制造方法;RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HAVING CURED OBJECT OF THE SAME AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

本发明提供一种组成物，其特征在于包含：(A)1分子中具有2个以上氰氧基的氰酸酯化合物、(B)通式(2)所示的在1分子中具有2个以上酚性羟基、并具有特定结构的酚化合物、(C)无机填充剂、及(D)通式(3)或通式(4)所示的具有特定结构的环氧树脂，(B)酚化合物中的酚性羟基相对于(A)氰酸酯化合物中的氰氧基的莫耳比为0.2~0.4，且(D)环氧树脂中的环氧基相对于(A)氰酸酯化合物中的氰氧基的莫耳比为0.04~0.25。; (B) a phenol compound, which is represented by General Formula (2), has two or more phenolic hydroxyl groups in a molecule, and has a specific structure; (C) an inorganic filler; and (D) an epoxy resin, which is represented by General Formula (3) or General Formula (4) and has a specific structure. A mole ratio of a phenolic hydroxyl group of the phenol compound to a cyanato group of the (A) cyanate ester compound ranges from 0.2 to 0.4, and a mole ratio of an epoxy group of the (D) epoxy resin to a cyanato group of the (A) cyanate ester compound ranges from 0.04 to 0.25.