| 摘要 |
<p>The present invention provides an apparatus and a method to manufacture a semiconductor which can minimize a bending phenomenon on the center and edges of a wafer when the wafer is seated on a wafer support part. According to an embodiment, the apparatus to manufacture the semiconductor having a chamber includes: a transferring part transferring the wafer; the wafer support part on which the water transferred by the transferring part is seated and which is installed within the chamber; an upper and a lower heating part arranged over and under the wafer support part respectively; and a heating controller changing the heating temperature of either the upper heating part or the lower heating part to minimize the bending phenomenon on the center and its vicinity of the wafer during a wafer loading time until the wafer is transferred to the chamber and seated on the wafer support part.</p> |
