发明名称 |
Silicon Dot Formation by Direct Self-Assembly Method for Flash Memory |
摘要 |
Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements comprising a substantially equal size within a memory cell. A copolymer solution comprising first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material comprising a regular pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The first or second polymer species is then removed resulting with a pattern of micro-domains or the polymer matrix with a pattern of holes, which may be utilized as a hard-mask to form a substantially identical pattern of discrete storage elements through an etch, ion implant technique, or a combination thereof. |
申请公布号 |
US2015054059(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201313974155 |
申请日期 |
2013.08.23 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Chen Chih-Ming;Lee Cheng-Te;Wang Szu-Yu;Yu Chung-Yi;Tsai Chia-Shiung;Chen Xiaomeng |
分类号 |
H01L29/792;H01L29/66 |
主分类号 |
H01L29/792 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
spin-coating a substrate with a copolymer solution comprising first and second polymer species over a first dielectric layer disposed over an upper surface of the substrate; annealing the substrate, which results in a self-assembly of the copolymer solution into a phase-separated material, wherein the first polymer species forms a polymer matrix, and the second polymer species forms a pattern of micro-domains within the polymer matrix; removing the second polymer species from the polymer matrix, which replaces the pattern of micro-domains with a substantially identical pattern of first holes within the polymer matrix; and implanting a conductive material through the pattern of holes to form a substantially identical pattern of discrete storage elements within the first dielectric layer. |
地址 |
Hsin-Chu TW |