发明名称 |
HEAT SHIELD FILM AND METHOD OF FORMING HEAT SHIELD FILM |
摘要 |
<p>A heat shield film (100) that is formed on a wall surface of an aluminum-based member (W) includes: a matrix layer (10) diffusion-bonded to the wall surface (diffusion bonding layer (10'')), having a coefficient of linear expansion of 15x l0-6/K to 25xl0-6/K in a temperature range of ordinary temperature to 200°C and made of a porcelain enamel material; and hollow particles (20) dispersed in the matrix layer ( 10).</p> |
申请公布号 |
WO2015025208(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
WO2014IB01549 |
申请日期 |
2014.08.18 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
EDA, AKINORI |
分类号 |
C03C8/14;C03C8/22;C23D5/02;C23D7/00 |
主分类号 |
C03C8/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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