| 发明名称 |
HOT MELT COMPOSITIONS WITH IMPROVED ETCH RESISTANCE |
| 摘要 |
Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices. |
| 申请公布号 |
US2015053643(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201313971537 |
申请日期 |
2013.08.20 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
BALANTRAPU Krishna;BARR Robert K. |
| 分类号 |
C09D11/34;H05K3/06;H05K3/18;B05D3/06 |
主分类号 |
C09D11/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hot melt composition comprising one or more non-aromatic cyclic (alkyl)acrylates, one or more waxes comprising an acid number of 0 to 30 mg KOH/g and one or more radical initiators. |
| 地址 |
Marlborough MA US |
