MAGNETIC STRUCTURE FOR METAL PLATING CONTROL

摘要

Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity.

主权项

1. A system for promoting metal plating profile uniformity, comprising:
a magnetic structure configured to modify at least one of an edge plating current or a center plating current associated with a metal plating process for a semiconductor wafer, the magnetic structure positioned at a first position with respect to the semiconductor wafer.