THIN FLEXIBLE CIRCUITS

摘要

An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.

主权项

1. A method for fabricating a flexible circuit, comprising:
providing a first dielectric layer having a first metal layer formed on a first side of the first dielectric layer; forming a first dielectric layer; forming a first metal layer on a first side of the first dielectric layer; situating a mask having a pattern on the first metal layer; processing the pattern into the first metal layer; removing the mask; forming a second dielectric layer on the first metal layer; forming a lift-off resist layer on the second dielectric layer; forming a photosensitive resist layer having a pattern of at least one opening on the lift-off resist layer; etching at least one opening through the lift-off resist layer and the second dielectric layer forming an opening through the lift-off resist layer and second dielectric layer to the first metal layer; and depositing a metal towards the at least one opening to form at least one bond pad on the first metal layer.