| 摘要 |
<p>The present invention relates to a solder joint inspection method capable of improving the reliability of solder joint inspection for an embedded component. The solder joint inspection method according to an aspect of the present invention comprises the steps of: setting an inspection region at a position spaced apart at a predetermined distance from a lead end of the embedded component solder-joined to a pad formed on a substrate; extracting height information on a solder positioned in the inspection region; and a step of determining whether a solder joint defect occurs on the basis of the extracted height information on the solder. Therefore, by determining whether the solder joint defect occurs on the basis of the height information on the solder at an outer region of the pad, which is relatively distant from the lead end of the embedded component, the reliability of solder joint inspection for the embedded component can be improved.</p> |
