| 摘要 |
<p>The invention relates to a drying apparatus for use in a lithography system for drying a planar object such as a wafer, the apparatus comprising a drying device for eliminating liquid or droplets thereof from a planar target such as a wafer, wherein said device comprises a first slit and a second slit arranged in close proximity of the target, a gap being present between the target and the dryer, the first slit included for supplying pressurised gas into said gap directed to the target, the second slit included for discharging said liquid by means of said gas away from the target.</p> |
