CHANGING PRINTING CONTROL PARAMETER BASED ON MEASURED SOLDER PASTE DEPOSIT IN CERTAIN SUBAREA OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board.SOLUTION: The method has the steps of: (a) identifying first subareas of the printed circuit board and exhibiting a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board; (b) identifying second subareas of the printed circuit board and exhibiting a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board, wherein the first repeatability is smaller than the second repeatability; (c) transferring solder paste onto the printed circuit board at least at the second subareas of the printed circuit board; (d) measuring the amount of solder paste which has been transferred to the second subareas; and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board in response to the measured amount of solder paste which has been transferred to the second subareas.