SYSTEMS AND METHODS FOR MOLECULAR BONDING OF SUBSTRATES

摘要

A method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure point and the two support points a strain toward the second substrate, bringing the deformed first surface and the second surface into contact, and progressively releasing the strain to facilitate bonding of the substrates while minimizing or avoiding the trapping of air bubbles between the substrates.

主权项

1. A bonding system for bonding a first substrate to a second substrate, comprising:
at least two support elements located and configured to support a first substrate thereon such that the first substrate is unsupported between the at least two support elements; a support device configured to support a second substrate in alignment with the first substrate when the first substrate is supported by the at least two support elements; and at least one strain application device located and configured to contact and strain a first substrate supported by the at least two support elements at a location between the at least two support elements and deform a first substrate such that the first substrate bends toward and contacts the second substrate; wherein the at least one strain application device is configured to progressively release the strain applied to a first substrate such that a bonding wave propagates between the first substrate and a second substrate supported on the support device response to the release of the strain applied to the first substrate.