INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE AND RELATED METHOD

摘要

An integrated circuit (IC), design structure, and a method of making the same. In one embodiment, the IC includes: a substrate; a dielectric layer disposed on the substrate; a set of wire components disposed on the dielectric layer, the set of wire components including a first wire component disposed proximate a second wire component; a bond pad disposed on the first wire component, the bond pad including an exposed portion; a passivation layer disposed on the dielectric layer about a portion of the bond pad and the set of wire components, the passivation layer defining a wire structure via connected to the second wire component; and a wire structure disposed on the passivation layer proximate the bond pad and connected to the second wire component through the wire structure via.

主权项

1. A method, comprising:
forming a dielectric layer on a substrate; forming a metal layer on the dielectric layer; forming a set of wire components from the metal layer, the set of wire components including a first wire component proximate a second wire component; depositing a bond pad on the first wire component; forming a passivation layer on the dielectric layer and about portions of the set of wire components, the passivation layer including a wire component via connected to the second wire component; and forming a wire structure above the second wire component and physically isolated from the bond pad.