发明名称 |
Methods for Forming Resistive Switching Memory Elements by Heating Deposited Layers |
摘要 |
Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal annealing techniques. During heating, the oxide layer may decompose and react with the metal-containing layer. Oxygen from the decomposing oxide layer may form a metal oxide with metal from the metal-containing layer. The resulting metal oxide may exhibit resistive switching for the resistive switching memory elements. |
申请公布号 |
US2015056748(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201414505128 |
申请日期 |
2014.10.02 |
申请人 |
Intermolecular Inc. |
发明人 |
Kumar Pragati;Barstow Sean;Chiang Tony P.;Shanker Sunil |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
forming a first layer comprising a first metal; forming a second layer comprising a second metal and oxygen,
wherein the first metal is different from the second metal; and heating the first layer and the second layer,
wherein heating causes oxygen migration from the second layer into the first layer and oxidation of the first metal in the first layer thereby forming a first metal oxide in a first portion of the first layer, andwherein the first metal oxide is operable as a resistive switching layer. |
地址 |
San Jose CA US |