MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY

摘要

The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

主权项

1. A manufacturing method of micro-electro-mechanical system (MEMS) device, comprising:
providing an integrated circuit device including a substrate and an electrical structure on the substrate, wherein the electrical structure includes at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section with the at least one second connection section; etching the structure layer to form at least one movable structure and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region; wherein the movable structure is not directly connected to the cap.