| 发明名称 |
METHOD FOR PRODUCING A SENSOR |
| 摘要 |
The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap. |
| 申请公布号 |
US2015056725(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314378363 |
申请日期 |
2013.02.08 |
| 申请人 |
Epcos AG |
发明人 |
Pahl Wolfgang;Leidl Anton;Portmann Jürgen;Eichinger Robert;Siegel Christian;Nicolaus Karl;Wassner Thomas;Sedlmeier Thomas |
| 分类号 |
B81C1/00;H01L21/66;H04R31/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing a sensor (SEN), comprising the following steps of:
arranging a sensor element on a carrier, arranging a cover on the sensor element, wherein the sensor element is enclosed between the cover and the carrier, adhesively bonding a carrier film onto the cover, producing an opening in the carrier film and the cover, wherein the openings in the carrier film and the cover at least partly overlap. |
| 地址 |
München DE |
