| 摘要 |
<p>PURPOSE: A method for processing a surface of a printed circuit board is provided to improve process efficiency by preventing residues on the surface of the printed circuit board using a hardening mask. CONSTITUTION: A method for processing a surface of a printed circuit board comprises following steps. A hardening mask including an opening area is manufactured. The opening area corresponds to an area to be processed, and a lamination process is performed according to set time and pressure (S182). The surface of a printed circuit board is processed and plated after the lamination process (S184). The hardening mask is separated from the printed circuit board after the surface treatment process (S186). [Reference numerals] (AA) Start; (BB) End; (S182) Align a stiffening mask on a panel and perform a lamination process; (S184) Process and plate the surface of a printed circuit board after the lamination process; (S186) Separate the hardening mask from the printed circuit board after the surface treatment process</p> |
