发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND HIGH FREQUENCY POWER AMPLIFIER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device and a high frequency power amplifier module that reduce a variation in a transmission power characteristic.SOLUTION: The semiconductor integrated circuit device includes, for example, a bandgap reference circuit BGR, a regulator circuit VREG, and a reference voltage correction circuit VREFCTL1 disposed therebetween and including a unity gain buffer BF, and VREFCTL1 corrects a variation in a bandgap voltage Vbg from BGR. VREFCTL1 includes first to third resistance paths having different resistance values (Rr1-Rr3), and performs the correction by selectively supplying a current (I2) reflecting an output voltage of BF to any one of the first to third resistance paths. The selection is performed by connecting a bonding wire BW to any one of terminals REF1-REF3.
申请公布号 JP2015039087(A) 申请公布日期 2015.02.26
申请号 JP20110277875 申请日期 2011.12.20
申请人 MURATA MFG CO LTD 发明人 IIJIMA MASANORI;MORISAWA FUMIMASA
分类号 H03F3/24;H03F1/30;H03F3/68 主分类号 H03F3/24
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