| 发明名称 |
Adhesive Composition and Article |
| 摘要 |
An adhesive composition blend and an article are disclosed. The adhesive composition blend includes a higher-melt fluoropolymer component having a melting point greater than a predetermined maximum service temperature and a lower-melt fluoropolymer component having a melting point less than a predetermined applying temperature. The melting point of the higher-melt fluoropolymer is at least 20° C. greater than the melting point of the lower-melt fluoropolymer. Additionally or alternatively, the adhesive composition blend includes a higher-melt fluoropolymer component having a melting point between about 200° C. and about 330° C. and a lower-melt fluoropolymer component having a melting point between about 100° C. and about 260° C. The article includes a substrate and the adhesive. |
| 申请公布号 |
US2015056443(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314010386 |
申请日期 |
2013.08.26 |
| 申请人 |
Tyco Electronics Corporation |
发明人 |
Wang Lei;Yun Hyo Chang;Hurrell David A. |
| 分类号 |
C09J127/20 |
主分类号 |
C09J127/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An adhesive composition blend, comprising:
a higher-melt fluoropolymer component having a melting point greater than a predetermined maximum service temperature; and a lower-melt fluoropolymer component having a melting point less than a predetermined applying temperature;wherein the melting point of the higher-melt fluoropolymer is at least 20° C. greater than the melting point of the lower-melt fluoropolymer. |
| 地址 |
Berwyn PA US |
